无线电通信技术2011，Vol.37Issue(5)：41-43,3.
一种新型电子设备热设计分析
Analysis on Thermal Design of a Novel Electronic Equipment
张斌 1武沛勇 1韩凤廷1
作者信息
- 1. 中国电子科技集团公司第五十四研究所,河北石家庄050081
- 折叠
摘要
Abstract
The design of heat radiation is more and more difficult with the improvement of thermal flow density in electronic equipment. At first, the equipment composition is put forward from the point of view of general design, to form an entire design. Secondly, the heat radiation design is considered as key technology and the design goal is defined by analyzing problems to be solved. Furthermore, the heat radiation measures in whole enclosure are introduced, the blower selection and the air flow channel are analyzed. Finally, the design scheme is tested to be effective and practical by software analysis and simulation, experiments and long term running.关键词
电子设备/热设计/热仿真分析/结构设计Key words
electronic equipments/thermal design/thermo simulation analysis/structure design分类
信息技术与安全科学引用本文复制引用
张斌,武沛勇,韩凤廷..一种新型电子设备热设计分析[J].无线电通信技术,2011,37(5):41-43,3.
