襄樊学院学报2011，Vol.32Issue(8)：36-40,5.
混合集成电路中金铝键合可靠性的实验设计
DOE for Reliability of Gold-Aluminum Bonding in HIC
畅兴平1
作者信息
- 1. 襄樊学院物理与电子工程学院,湖北襄阳441053
- 折叠
摘要
Abstract
Based on the reliability of the Al/Au bonding system, it proposed a experiment scheme with the acceleration stress of 150℃. It shows that the rate of change increases with the increase of time variation under high temperature storage. When the rate of change of interconnection contact resistance in Al/Au system achieved 20%, the rate of change of the resistance increased obviously; Under the constant temperature stress, the contact resistance increased and the linkage intensity dropped.关键词
混合集成电路/Al／Au键合/寿命评价/加速实验Key words
Hybrid integrated circuits（HIC）/Al/Au bonding/Life assessment/Accelerated test分类
信息技术与安全科学引用本文复制引用
畅兴平..混合集成电路中金铝键合可靠性的实验设计[J].襄樊学院学报,2011,32(8):36-40,5.
