西安电子科技大学学报（自然科学版）2012，Vol.39Issue(1)：49-55,104,8.DOI:10.3969/j.issn.1001-2400.2012.01.010
使用模式分解方法的过孔串扰机制研究
New model decomposed method to simulate the crosstalk between vias
摘要
Abstract
A model decomposed method is proposed for efficient simulation of crosstalk between vias in high speed circuits. The 3D interconnect structure is first decoupled into a power-ground plane pair and a microstrip line structure which are coupled in the vias, then we solve each parts by using different methods, and finally, the equivalent circuits of each part are integrated to simulate the system performance. Compared with full wave simulation, the simulation time is reduced from 187 minutes to 4 minutes with considerable accuracy. The structure of the printed circuit board and vias that affect the system performance are analyzed carefully, and it is found that the crosstalk coefficient is approximately proportional to the magnitudes of transform impedance in the location of vias in the frequency domain. Some engineering implications on reducing crosstalk noise in practical PCB, such as using a thin dielectric layer, adding decoupling capacitors and adjusting the locations of the vias, are discussed through a series of simulation. The time domain simulation result shows that the magnitude of crosstalk noise is reduced by over 98% when the interconnect structure is designed properly.关键词
高速电路/电磁兼容/串扰/传输阻抗Key words
high-speed circuits/electromagnetic compatibility/crosstalk/transform impedance分类
信息技术与安全科学引用本文复制引用
申振宁,庄奕琪,曾志斌..使用模式分解方法的过孔串扰机制研究[J].西安电子科技大学学报（自然科学版）,2012,39(1):49-55,104,8.基金项目
国家自然科学基金资助项目(60276028) （60276028）
武警工程学院基础研究基金资助项目(WJY-201022) （WJY-201022）
中央高校基本科研业务费专项资金资助项目(K5051125007) （K5051125007）
