表面技术2012，Vol.41Issue(3)：105-108,129,5.
化学镀法制备铜包覆SiC颗粒的研究
Study on the Preparation of Cu-coated SiC Particles by Electroless Plating
赵丹 1宋红章 1孙洪巍 1胡行 1杨德林1
作者信息
摘要
Abstract
Copper coated SiC particles were prepared by the electroless plating method. The influence of pretreat-rnent, the plating solution component, the pH value and loadage on the Cu layer were analyzed. Furthermore, the effects of adjusting the content of sulfate and the loadage on controlling the copper content in the composite powder were compared. The phase, morphology and component of powder were analyzed with XRD, SEM and EDS to obtain the optimum plating process. The results show that the uniform Cu coat can be obtained only when the activating solution for pretreatment deposited for some time; Along with the pH value and the sulfate content increases, the speed of plating increases, but the cladding perfection and uniformity of powder reduces; Adjusting the loadage is a better way to control the content of copper in composite powder.关键词
化学镀铜/SiC颗粒/预处理/镀速/铜含量Key words
electroless copper plating/ SiC particals/ pretreatment/ plating speed/ copper content分类
化学化工引用本文复制引用
赵丹,宋红章,孙洪巍,胡行,杨德林..化学镀法制备铜包覆SiC颗粒的研究[J].表面技术,2012,41(3):105-108,129,5.
