传感技术学报2012，Vol.25Issue(2)：193-197,5.DOI:10.3969/j.issn.1004-1699.2012.02.010
基于有限元法的MEMS加速度计热应力分析
Thermal Stress Analysis of MEMS Accelerometer Based on Finite Element Method
摘要
Abstract
Residual stress has a significant impact on mechanical properties, lifetime and reliability of MEMS devices. Based on MEMS capacitive accelerometer and thermal structure coupled-field analysis, the effects of thermal stress have been simulated and analyzed, and compared with the experimental results. The results show that thermal stress is not the main factor which may affect the device performance while some physical factors and fabrication error that have not been taken into account of the simulation model are the main factors. The improvement suggestions for the process are put forward, which can provide reference for the perfection of the accelerometer temperature compensation model and redesign of the accelerometer.关键词
MEMS/有限元法/电容式加速度计/热应力Key words
MEMS/FEM/accelerometer/thermal stress分类
信息技术与安全科学引用本文复制引用
游侠飞,吴昌聚,郑阳明,金仲和..基于有限元法的MEMS加速度计热应力分析[J].传感技术学报,2012,25(2):193-197,5.基金项目
项目来源:国家自然科学基金项目(61106113) （61106113）
