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不同溅射气体对a-IGZO TFT特性的影响

张耿 王娟 向桂华 蔡君蕊 孙庆华 赵伟明

电子器件2012,Vol.35Issue(2):125-129,5.
电子器件2012,Vol.35Issue(2):125-129,5.DOI:10.3969/j.issn.1005-9490.2012.02.003

不同溅射气体对a-IGZO TFT特性的影响

Effect of Various Sputtering Gas on the Characteristics of a-IGZO TFT

张耿 1王娟 2向桂华 3蔡君蕊 3孙庆华 4赵伟明3

作者信息

  • 1. 东莞宏威数码机械有限公司,广东东莞523080
  • 2. 中山大学理工学院,广州510275
  • 3. 东莞有机发光显示产业技术研究院,广东东莞523080
  • 4. 东莞彩显有机发光科技有限公司,广东东莞523080
  • 折叠

摘要

Abstract

Based on different IGZO TFTs have been studied and the IGZO films were deposited using Pulsed DC sputtering method with various single-component sputtering gases( Ar,O2 ,and N2), including lack-oxygen( Ar) ,rich-oxygen (O2) ,oxygen-replacement(N2)types. By employing the AES,XRD,AFM analysis methods,the composition and miero-structure of the IGZO films and the corresponding target cross sections were investigated. It indicates that the sputtering gases affect significantly on the properties of the LGZO films. The results show that afVer annealing, Ar-5GZO TFT has good characteristics,such as S slope 1 V/dec,mobility 8.3 cm2/Vs,Ion/Ioff≧l05.

关键词

薄膜晶体管/IGZO膜/溅射气体/脉冲直流

Key words

Thin Film Transistor (TFT)/IGZO film/ Sputtering gas/ Pulsed DC

分类

信息技术与安全科学

引用本文复制引用

张耿,王娟,向桂华,蔡君蕊,孙庆华,赵伟明..不同溅射气体对a-IGZO TFT特性的影响[J].电子器件,2012,35(2):125-129,5.

电子器件

OA北大核心CSTPCD

1005-9490

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