激光技术2012，Vol.36Issue(3)：364-367,4.DOI:10.3969/j.issn.1001-3806.2012.03.020
模具半导体激光强韧化工艺研究
Process research of diode laser surface hardening for dies
闵大勇 1王爱华 2熊志红 1卢飞星2
作者信息
- 1. 华中科技大学材料科学与工程学院,武汉430074
- 2. 华工激光工程有限责任公司,武汉430223
- 折叠
摘要
Abstract
In outer to improve the surface hardness and toughness of dies, several typical die materials, such as 7CrSiHnMoV, Crl2MoV, CrMo cast iron, were hardened with a high power diode laser and the optimal laser parameters were obtained. Results show that the optimal laser parameters can meet the requirement of the hardness of dies and provide a guarantee to the hardness and toughness of dies in future application.关键词
激光技术/半导体激光/模具/激光淬火Key words
laser technique/ diode laser/ die/ laser quenching分类
矿业与冶金引用本文复制引用
闵大勇,王爱华,熊志红,卢飞星..模具半导体激光强韧化工艺研究[J].激光技术,2012,36(3):364-367,4.
