计算机工程与科学2012，Vol.34Issue(4)：28-31,4.DOI:10.3969/j.issn.1007-130X.2012.04.006
一种多芯片封装(MCP)的热仿真设计
Thermal Simulation and Design of a Multi-Chip Package
王金兰 1仝良玉 1刘培生 2缪小勇1
作者信息
- 1. 南通大学江苏省专用集成电路设计重点实验室,江苏南通226019
- 2. 南通富士通微电子股份有限公司,江苏南通226006
- 折叠
摘要
Abstract
Thermal design of the IC package is to improve the thermal dissipation ability of the package. Multi chip-package (MCP) is designed to increase the density of integrated electronics and improve the processing power. Due to the multi-heat sources in a package, heat management becomes more critical for MCPs. This paper presents the finite elements simulation of FBGA MCP product. The effect of chip thickness to the thermal resistance of the package is presented. Through a comparison of the thermal performances, the chip placement is optimized. The simulation results show that chip thickness does not have a profound effect to the thermal resistance of MCPs, and the smallest thermal resistance is obtained when the two chips are symmetrically arranged in the center of the substrate.关键词
多芯片封装/FBGA/热管理/有限元仿真Key words
multi-chip package (MCP)/FBGA/ thermal management/finite elements simulation分类
信息技术与安全科学引用本文复制引用
王金兰,仝良玉,刘培生,缪小勇..一种多芯片封装(MCP)的热仿真设计[J].计算机工程与科学,2012,34(4):28-31,4.
