宁夏工程技术2012，Vol.11Issue(1)：43-45,3.
晶圆贴膜金刚刀划片工艺
The wafer dicing process film diamond knife
张虹1
作者信息
- 1. 宁夏索特科新型器件有限公司,宁夏银川750011
- 折叠
摘要
Abstract
In order to improve production efficiency,reduce labor intensity,based on the contrast of advantages and disadvantages between grinding wheel dicing and diamond knife dicing process methods,the methods of the wafer dicing film diamond knife process was used,the dicing process of lithium niobate single crystal was completed by controlling the dicing process parameters.This method not only improves the quality of dicing but also increases dicing yield.Mass practice proved that the wafer film diamond knife dicing process is feasible;and for the manufacturing enterprise,production efficiency and dicing yield can be increased meantime,but there is no need for invest in equipment.关键词
声表面波器件/金刚刀划片/UV膜Key words
surface acoustic wave device/diamond cutter dicing/UV film引用本文复制引用
张虹..晶圆贴膜金刚刀划片工艺[J].宁夏工程技术,2012,11(1):43-45,3.
