农业工程学报2012，Vol.28Issue(11)：248-253,6.DOI:10.3969/j.issn.1002-6819.2012.11.040
改性豆胶胶合板热压工艺优化及固化机理分析
Curing mechanism of modified soy-based adhesive and optimized plywood hot-pressing technology
摘要
Abstract
In order to reduce usage of formaldehyde content adhesives and popularize environment friendly adhesive application in plywood, the modified soy-based adhesive (SBA) was prepared as a new kind of waterproof adhesive to make plywood. The hot-press conditions were optimized by using orthogonal experimental design. The curing mechanism of soy-based adhesive was investigated by FTIR, XPS and TG-DTG. The results showed that (i) hot-press temperature, pressure and time could affect the bonding strength and the contribution order was hot-press temperature > hot-press pressure > hot-press time; (ii) under the optimized conditions (hot-press temperature 140℃, hot-press pressure 1.0 MPa and hot-press time 4.69 min), the water-resistant bonding strength of plywood was up to 0.91 MPa, which meets the requirement of plywood type II in GB/T 9846-2004. Fourier transform infrared spectroscopy (FTIR) analysis showed the SBA was crosslinked by chemical reaction during the curing process, the crosslinking gave rise to the increase of amino bonds and reduce of hydrophilic groups. X-ray photoelectron spectroscopy (XPS) analysis showed that during the curing process amide reaction occurred and accompanied with amination which induced the formation of 3D structure of SBA. And the TG-DTG results showed that SBA cured completely when the temperature was in the range of 140-150°C, above this range it could result in decomposition of SBA. The research can provide a reference for SBA application in plywood industry.关键词
优化/固化/机理/改性豆胶/胶合强度/压缩率Key words
optimization, curing, mechanisms, soy-based adhesive, bonding strength, compression ratio分类
化学化工引用本文复制引用
陈奶荣,林巧佳,卞丽萍..改性豆胶胶合板热压工艺优化及固化机理分析[J].农业工程学报,2012,28(11):248-253,6.基金项目
国家自然科学基金资助项目(30972311). （30972311）
