中国机械工程2012，Vol.23Issue(8)：897-900,4.
二维多芯片组件的分布矩阵热设计
Distribution of Two-dimension Matrix＇s Thermal Design Based on MCM
摘要
Abstract
Based on the matrix arrangement of the main power devices on the substrate the paper proposed an idea——MD method.MD method described a basic approach which was established through finite element simulation and was similar to the distribution matrix of MCM chipset.Using Icepak thermal design software,the shape and the size of the matrix-distribution and the distribution of the chip position in the matrix were further simulated.Finally,the paper comes to the conclusion of the matrix-distribution,which is suitable for ventilated heat modalities and rule-substrates,then provides an appropriate application scope of MD method.关键词
分布矩阵/有限元仿真/多芯片组件/热设计Key words
matrix-distribution(MD)/finite element simulation/multi-chip module(MCM)/thermal design分类
信息技术与安全科学引用本文复制引用
何倩鸿,杨平,魏巍..二维多芯片组件的分布矩阵热设计[J].中国机械工程,2012,23(8):897-900,4.基金项目
国家自然科学基金资助项目 （）
