Ag在单晶硅(111)基面上的反应润湿与固液界面能计算OA北大核心CSCDCSTPCD
Reactive wetting and calculation of solid-liquid interfacial energy of silver-silicon (111)
采用滴座法研究Ag在高定向生长单晶硅(111)基面上的高温反应润湿行为及固液界面结构.结果表明,Ag/Si(1 11)润湿体系在1200℃高温下的最终润湿角为96.7°,呈现不润湿现象,反应润湿界面有Si原子溶解到液态Ag中,但没有新相生成,Si和Ag仍以单质形式存在,因此Ag(1)/Si(s)界面能保持不变.通过计算得到1200℃下Ag/Si(111)润湿体系的固体表面能和固液界面能分别为565.6和667.1mJ·m-2.
In this paper, the reactive wetting behavior of silver and the solid - liquid interfacial structure of reactive wetting were investigated on the crystal face (111) of the single crystal silicon by the sessile drop technique at high temperature. It was showed that the final contact angle of silver - silicon (111) was 96.7°at 1 200℃,, appearing unwetting. Atomic diffusion of silicon was detected in the molten silver matrix. However, no new phase emerged at th…查看全部>>
廖选茂;朱定一
福州大学材料科学与工程学院,福建福州350108福州大学材料科学与工程学院,福建福州350108
矿业与冶金
润湿角固液界面能反应型润湿Ag单晶硅
contact angle solid - liquid interfacial energy reactive wetting Ag monocrystalline silcon
《福州大学学报（自然科学版）》 2012 (2)
Ni-Al-C合金中石墨的生长机理及球化理论研究
265-269,5
国家自然科学基金资助项目(50471007)福建省自然科学基金资助项目(2011J01292)