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铜及铜合金环保型化学抛光工艺新探

周飞云 于娟 陈发东 高建纲 宋庆平 张志国

安徽工程大学学报2012,Vol.27Issue(2):44-47,4.
安徽工程大学学报2012,Vol.27Issue(2):44-47,4.

铜及铜合金环保型化学抛光工艺新探

A new environment-friendly chemical polishing recipe and process for copper and its alloys

周飞云 1于娟 2陈发东 1高建纲 1宋庆平 1张志国1

作者信息

  • 1. 安徽工程大学生物化学与工程学院,安徽芜湖241000
  • 2. 山东华鲁恒升化工股份有限公司,山东德州253024
  • 折叠

摘要

Abstract

To satisfy the surface-treating requirements for copper and its alloys,a new recipe of chemical polishing solutions was put up and the best polishing process was studied in this work. The experimental results show that the most favorable technological conditions are as follows:the volume ratio of nitric acid,hydrogen peroxide,water and stabilizing solution is 1 : 1 : 7 " 1 and the amount of poly(ethylene glycol) is 20.0 g/L,the polishing temperature is 25 centigrade and the polishing time is 12 s. The advantages of this recipe are simple composition, little environment pollution, low cost, fast-polishing and easyoperating. The best effects for polishing copper or its alloys can be acquired with good brightness with the most favorable polishing recipe.

关键词

铜及铜合金/化学抛光/环保型/表面处理

Key words

copper and its alloys/chemical polishing/environment-friendly/surface treatment

分类

矿业与冶金

引用本文复制引用

周飞云,于娟,陈发东,高建纲,宋庆平,张志国..铜及铜合金环保型化学抛光工艺新探[J].安徽工程大学学报,2012,27(2):44-47,4.

基金项目

安徽省自然科学青年基金资助项目 ()

安徽省自然科学研究基金资助项目 ()

安徽工程大学学报

2095-0977

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