半导体学报（英文版）2012，Vol.33Issue(6)：114-117,4.DOI:10.1088/1674-4926/33/6/066001
Anodic bonding using a hybrid electrode with a two-step bonding process
Anodic bonding using a hybrid electrode with a two-step bonding process
摘要
Abstract
A two-step bonding process using a novel hybrid electrode is presented.The effects of different electrodes on bonding time,bond strength and the bonded interface are analyzed.The anodic bonding is studied using a domestic bonding system,which carries out a detailed analysis of the integrity of the bonded interface and the bond strength measurement.With the aid of the hybrid electrode,a bubble-free anodic bonding process could be accomplished within 15-20 min,with a shear strength in excess of 10 MPa.These results show that the proposed method has a high degree of application value,including in most wafer-level MEMS packaging.关键词
wafer bonding/anodic bonding/electrode configuration/bubble-freeKey words
wafer bonding/anodic bonding/electrode configuration/bubble-free引用本文复制引用
Luo Wei,Xie Jing,Zhang Yang,Li Chaobo,Xia Yang..Anodic bonding using a hybrid electrode with a two-step bonding process[J].半导体学报（英文版）,2012,33(6):114-117,4.基金项目
Project supported by the Development Project of the Scientific Equipment of the Chinese Academy of Sciences (No.YZ200940). （No.YZ200940）
