广州化学2012，Vol.37Issue(2)：39-45,7.
功率型LED封装用高分子材料的研究进展
Research Progress of Polymer Materials for High-Power LED Encapsulation
高南 1刘伟区 2闫振龙 1孙越 1陈海生2
作者信息
- 1. 中国科学院广州化学研究所,广东广州510650 中国科学院研究生院,北京100049
- 2. 中国科学院广州化学研究所,广东广州510650
- 折叠
摘要
Abstract
With the development of high-power light emitting diode （HP-LED）, the packaging material of LED has become an important key technique for LED lighting in daily life. As for high-power LED, the characteristics of high refractive index, high transmittance, high thermal conductivity, excellent UV/thermal resistance, low stress and water absorption are required. At present, the polymer materials for LED packaging mainly included epoxy resins and organosilicones, and a lot of researches about modifications of them are focused on improving the refractive index, aging resistance, thermal conductivity, water absorption and mechanical property to satisfy the demands of high-power LED packaging. Among the materials, cycloaliphatic epoxy resins and nano-composite of organosilicones have wide development prospections for high-power LED encapsulations.关键词
功率型LED/封装材料/环氧树脂/有机硅Key words
high-power light emitting diode (HP-LED)/packaging material/epoxy resins/organosilicones分类
化学化工引用本文复制引用
高南,刘伟区,闫振龙,孙越,陈海生..功率型LED封装用高分子材料的研究进展[J].广州化学,2012,37(2):39-45,7.
