云南冶金2012，Vol.41Issue(3)：47-51,5.
SMT用焊锡粉生产技术现状及发展趋势分析
Analysis on Status Quo of Production Technologies of Solder Powder for Surface Mounting Technology (SMT) and Their Development Trend
摘要
Abstract
The contrast study on the atomization technology and classification technology for solder powder was conducted. By analyzing and studying the development of solder powder products in the last few years, the development direction of the atomization technology and classification technology for solder powder has been obtained. And then, the developing tendency of production technology of solder powder was predicted.关键词
焊锡粉/气流雾化/离心雾化/超声雾化/分级技术Key words
Solder powder/ airflow atomization/ centrifugal atomization/ ultrasonic atomization/ classification technology分类
矿业与冶金引用本文复制引用
普友福,朱华明,武信..SMT用焊锡粉生产技术现状及发展趋势分析[J].云南冶金,2012,41(3):47-51,5.
