光学精密工程2012，Vol.20Issue(8)：1789-1795,7.DOI:10.3788/OPE.20122008.1789
利用数字全息干涉术测量电路板的连续弯曲形变
Measurement of continuous bending deformation for circuit boards by digital holographic interferometry
摘要
Abstract
The measurement of continuous bending deformation for a circuit board surface was achieved by using digital off-axis Fresnel holographic interferometry. 1 501 holograms were recorded by applying a displacement load to both ends of the circuit board from 0 to 15 mm by the step of 0. 01 mm. The interference phase difference was obtained by subtracting the complex amplitude phase distributions of two adjacent holograms with numerical reconstruction. Then, the out-of-plane displacement of the lighting measurement area was obtained according to the relationship between the phase difference and the out-of-plane displacement, and the measurement results were obtained by accumulating the bending deformation of the displacement load from 1 mm to 15 mm. By calculating the out-of-plane displacements of the same capacitor center in the lighting measurement area from five pieces of circuit boards with the same specifications, it indicates that the measurement results are no more than 0. 008 mm for the type A uncertainty, no more than 0. 003 5 mm for the type B uncertainty from a loading clamp and no more than 0. 008 7 mm for the combined uncertainty. The results show that the method based on digital off-axis Fresnel holographic interferometry for measuring the continuous bending deformation of the object with a large displacement load has good repeatability and stability.关键词
数字全息干涉术/离轴菲涅耳全息术/电路板/弯曲形变Key words
digital holographic interferometry/ off-axis Fresnel holography/ circuit board/ bending deformation分类
数理科学引用本文复制引用
杨德兴,许增奇,姜宏振,付永辉,王骏,邵兆申,赵建林..利用数字全息干涉术测量电路板的连续弯曲形变[J].光学精密工程,2012,20(8):1789-1795,7.基金项目
国家自然科学基金资助项目(No.61127011) （No.61127011）
