金刚石与磨料磨具工程2012，Vol.32Issue(2)：77-81,5.
新型抛光垫沟槽及其在化学机械抛光中的作用研究进展
Research progresses on the new groove shapes of polishing pad and their effects on CMP processes
摘要
Abstract
Tn the process of chemical mechanical polishing(CMP) , the performance of polishing pad is one of the most important factors that affects the quality of polished surface and polishing efficiency, which is influenced by the surface groove shape of the pad surface. In order to provide a reference for further research on the groove performances of polishing pad, the research progress on new groove structures of polishing pad was presented, and the effects of new pad groove structures on the CMP processes were summarized.关键词
化学机械抛光/抛光垫/表面沟槽Key words
chemical mechanical polishing/ polishing pad/ surface groove分类
矿业与冶金引用本文复制引用
方照蕊,魏昕,杨向东,邹微波..新型抛光垫沟槽及其在化学机械抛光中的作用研究进展[J].金刚石与磨料磨具工程,2012,32(2):77-81,5.基金项目
国家自然科学基金项目(No.51175092) （No.51175092）
教育部高校博士学科专项科研基金项目(No.20104420110002) （No.20104420110002）
广东省自然科学基金项目(No.10151009001000036)资助 （No.10151009001000036）
