现代制造工程Issue(7)：26-29,39,5.
碳化硅衬底超精密加工技术
Ultra-precision machining technology of silicon carbide substrates
摘要
Abstract
The best process can be obtained by contrast of different machining methods. Slicing process can use multi-wire sawing method and combination of multi-wire sawing and ultrasonic sawing. Double-side lapping can achieve low warp and ELJD grinding can realize high velocity, efficiency and surface quality, so they are widely used in grinding process. By the use of chemical mechanical polishing super smooth surface can be obtained in polishing during which course polishing aims at high efficiency while improving surface quality is the target of fine polishing. The existing problem of SiC substrates is analyzed and the trend of ultra-precision machining is pointed out.关键词
多线切割/双面研磨/ELID磨削/化学机械抛光/超光滑表面Key words
multi-wire sawing/double-side lapping/Electrolytic In-Process Dressing(ELID)grinding/Chemical Mechanical Polis-hing( CMP) /super smooth surface分类
机械制造引用本文复制引用
袁铁军,张红蕾,张广冬..碳化硅衬底超精密加工技术[J].现代制造工程,2012,(7):26-29,39,5.基金项目
江苏省光子制造科学与技术重点实验室开放基金项目(GZ201103) （GZ201103）
