材料工程Issue(8)：60-64,5.
凝固速率对Si-Ta合金固液界面稳定性的影响
Influence of Solidification Rate on Solid-liquid Interface of Si-Ta Alloy
摘要
Abstract
The influence of solidification rate on the solid-.liquid interface of Si-Ta alloy was studied by the zero power method. The results show that the solid-liquid interface morphology has the following evolution processing: planar interfac→shallow cell interface→cell interface→shallow cell interface→ planar interface when the solidification rate varies from 0. 3mm/min to 9. Omm/min. At the lower solidification rates, the experiment results can be consistent with Jackson-Hunt theory well. However, there is a deviation between the theory calculation and the experiment at the higher solidification rates. This is caused by the change of the thermodynamics and kinetics, and the solid-liquid interface can get to planar interface at the solidification rate V=5. Omm/min.关键词
定向凝固/电子束悬浮区熔/凝固速率/固液界面Key words
directional solidification/electron beam floating zone melting/solidification rate/solid-liquid interface分类
矿业与冶金引用本文复制引用
崔春娟,张军,吴昆,邹德宁,刘林,傅恒志..凝固速率对Si-Ta合金固液界面稳定性的影响[J].材料工程,2012,(8):60-64,5.基金项目
国家自然科学基金资助项目(50102004) （50102004）
高等学校博士学科点专项科研基金新教师基金资助(20096120120017) （20096120120017）
陕西省自然科学专项研究基金资助(2012JQ6004) （2012JQ6004）
陕西省教育厅专项科研基金(12JK0425) （12JK0425）
西安建筑科技大学科技计划资助项目(人才科技基金RC0907)(基础研究基金JC1109) （人才科技基金RC0907）
