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电子设备热设计在仿真软件中的运用

张万俊

舰船电子工程2012,Vol.32Issue(10):146-148,3.
舰船电子工程2012,Vol.32Issue(10):146-148,3.

电子设备热设计在仿真软件中的运用

Thermal Design of Electronic Equipment Used in the Simulation Software

张万俊1

作者信息

  • 1. 扬州万方电子技术有限责任公司,扬州225006
  • 折叠

摘要

Abstract

Application of thermal analysis technology to the product design stage to obtain the temperature distribution,in order to optimize design and improve the reliability of new products,extending its life.In this paper,take the design of 19 inches 2U electronic products for example,describes the thermal analysis using Ansys software supporting functions of numerical methods of thermal analysis and thermal analysis software features,forecasting new product within the distribution of heat distribution and airflow by using simulation analysis and the simulation results are compared with experiments to verify the correctness of the method.Based on the results corresponding to optimize the design parameters,a reasonable adjustment design layout,you can find the best design.And described the general characteristics and application methods about Ansys simulation.

关键词

电子设备/热设计/仿真分析/可靠性

Key words

electronic equipment/thermal design/simulation analysis/reliability

分类

信息技术与安全科学

引用本文复制引用

张万俊..电子设备热设计在仿真软件中的运用[J].舰船电子工程,2012,32(10):146-148,3.

舰船电子工程

1627-9730

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