金刚石与磨料磨具工程2012，Vol.32Issue(4)：19-21,26,4.
树脂结合剂金刚石砂轮精密磨削单晶硅片的磨削力研究
Research on the grinding force when machining monocrystalline silicon wafer with resin-bonded diamond grinding wheel
摘要
Abstract
Grinding experiments of silicon wafer with diamond grinding wheel was conducted , the grinding forces were tested. The effects of the condition parameters, such as axial feed rate, grinding speed and the diamond grit size, on axial grinding force were analyzed. The relationship between the axial grinding force F2 and condition parameters were obtained by the empirical formula. The research results showed that the grinding force increased with the increase of the axial feed rate and the diamond grit size, but decreased with the increase of grinding speed of the wheel.- The results also indicated that the axial feed rate vr had the most significant effect on the axial grinding force.关键词
单晶硅/磨削力/金刚石砂轮/精密磨削Key words
monocrystalline silicon/ grinding force/ diamond grinding wheel/ precision grinding分类
矿业与冶金引用本文复制引用
林培勇,魏昕,陈卓,任庆磊,董成祥..树脂结合剂金刚石砂轮精密磨削单晶硅片的磨削力研究[J].金刚石与磨料磨具工程,2012,32(4):19-21,26,4.基金项目
国家自然科学基金项目(NO.U0734008) （NO.U0734008）
广东省自然科学基金资助项目(NO.8151009001000048) （NO.8151009001000048）
