金刚石与磨料磨具工程2012，Vol.32Issue(4)：31-36,6.
锇在醋酸体系抛光液中化学机械抛光研究
Investigation on chemical mechanical polishing of osmium with CH3COOH-based slurry
摘要
Abstract
Osmium ( Os) may be used as new barrier material in copper interconnects of ultra-large scale integration. In this work, Os disk was polished with self-made CH3COOH-based slurry, the effect of H2O2, CH3COOH and BTA on the corrosion behaviours was investigated. It was found that,CH3CO0H played a role of pH adjusting agent, complexing agent and inhibitor in the slurry; In CH3COOH-based slurry, H2O2 could enhance the chemical action of the slurry on the surface of Os through accelerating the cathode reaction; The increasing of H2O2 concentration promoted the chemical corrosion ability to the surface of Os, but inhibited the formation of passive film; The addition of BTA decreased the value of 1corr, possibly due to the presence of the passive film; The thickness-of the passive film increased with the increase of BTA concentration.关键词
化学机械抛光/锇/醋酸/极化曲线/阻挡层材料Key words
chemical mechanical polishing/ osmium/ acetic acid/ polarization curve/ barrier layer material分类
矿业与冶金引用本文复制引用
储向峰,汤丽娟,董永平,乔红斌,朱小华..锇在醋酸体系抛光液中化学机械抛光研究[J].金刚石与磨料磨具工程,2012,32(4):31-36,6.基金项目
国家自然科学基金项目(50975002) （50975002）
教育部高校留学回国人员科研项目 （）
安徽工业大学创新团队项目(TD201204) （TD201204）
