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静电自组装制备复合磨粒及其对铜的抛光特性研究

黄亦申 许雪峰 姚春燕 胡建德 彭伟

中国工程科学2012,Vol.14Issue(10):82-89,8.
中国工程科学2012,Vol.14Issue(10):82-89,8.

静电自组装制备复合磨粒及其对铜的抛光特性研究

Preparation of composite abrasives by electrostatic self-assembly method and its polishing properties in Cu chemical mechanical polishing

黄亦申 1许雪峰 1姚春燕 1胡建德 1彭伟1

作者信息

  • 1. 浙江工业大学特种装备制造与先进加工技术教育部/浙江省重点实验室,杭州310032
  • 折叠

摘要

Abstract

The absorption characteristics of cationic polyelectrolyte PDADMAC and anionic polyelectrolyte PSS on benzoguanamine formaldehyde ( BGF) particles are investigated. The charging characteristics of BGF particles are changed and controlled using electrostatic self-assembly method. A variety of PE,-BGF/SiO2 composite abrasives are obtained. The as-prepared samples are analyzed by Zeta potential analysis, transmission electron microscope (TEM) and thermogravimetric (TG) analysis. The composite abrasives slurries are prepared for copper polishing. The polishing results indicate that it is SiO2abrasives, not only coated SiO2abrasive on polymer particles but also free SiO2abrasive in slurry, that offer the polishing action. The material removal rates of copper polishing are 264 nm/min, 348 nm/min and 476 nm/min using single SiO2 abrasive slurry, PE0-BGF/Si02mixed abrasives slurry and PE3-BGF/SiO2 composite abrasives slurry respectively. The surface roughness Ra of copper wafer (with 5μm x5 μm district) is decreased from 0. 166 μm to 3. 7 nm, 2. 6 nm and 1. 5 nm, and the surface peak-valley values Rpv are less than 20 nm, 14 nm and 10 nm using these kinds of slurries respectively.

关键词

化学机械抛光/抛光液/复合磨粒/聚电解质/铜片

Key words

chemical mechanical polishing/polishing slurry/composite abrasives/polyelectrolyte/copper

分类

机械制造

引用本文复制引用

黄亦申,许雪峰,姚春燕,胡建德,彭伟..静电自组装制备复合磨粒及其对铜的抛光特性研究[J].中国工程科学,2012,14(10):82-89,8.

基金项目

浙江省自然科学基金重点项目(Z1080625) (Z1080625)

中国工程科学

OA北大核心CSTPCD

1009-1742

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