表面技术2012，Vol.41Issue(4)：7-9,3.
丁二酸及钨酸钠对化学镀Ni-W-P镀层沉积速度的影响
The Effect of Succinic Acid and Sodium Tungsten on Plating Rate of Electroless Ni-W-P Alloy Coating
摘要
Abstract
Using eleetroless plating method, different ternary Ni-W-P alloy coatings were deposited on low carbon steel substrates by adjusting bath formula. The plating rate and surface morphology of different samples were characterized. The results show that the different content of reagent in the bath will have a great impact on the plating rate and the surface morphology of coating. Succinic acid has obvious accelerating action, plating rate decrease with increasing of content of sodium tungstate. The different content of succinic acid and sodium tungstate can change the surface morphology of the coating.关键词
化学镀/Ni-W-P镀层/镀速/表面形貌Key words
electroless plating/ Ni-W-P alloy coating/ plating rate/ surface morphology分类
化学化工引用本文复制引用
邢方方,程延海,张世举,陈衡阳..丁二酸及钨酸钠对化学镀Ni-W-P镀层沉积速度的影响[J].表面技术,2012,41(4):7-9,3.基金项目
国家自然科学基金资助项目(51006117) （51006117）
江苏高校优势学科建设工程资助项目 （）
