表面技术2012，Vol.41Issue(5)：102-104,107,4.
以酒石酸钾钠为主络合剂的化学镀铜添加剂研究
Study on the Additive for Electroless Copper Plating Taking the Potassium Sodium Tartrate as the Main Complexing Agent
摘要
Abstract
It studied the additive for electroless copper plating taking potassium sodium tartrate as complexing agen, and discussed the effect of CH3OH, K4[Fe(CN)6] ? 3H2O,2,2 -bipyridine on the stability of plating bath, the quality of electroplating layer, the deposition rate of plating, to determine the amount of additive. The results indicate that the optimal conditions of the electroless copper plating system as follows: CH3OH is 14 ml/L, K4 [Fe(CN)6] ? 3H2O is 30 mg/L,2,2'-bipyridine is 5 mg/L,plating 30 min in the bath, the copper deposition rate reaches 4. 6 μm/h,e-lectroplating layer appears shiny pale pink, and stability of plating bath is optimal, electroplating layer has good adhesion.关键词
酒石酸钾钠/化学镀铜/添加剂/沉积速率Key words
potassium sodium tartrat/ electroless copper plating/ additive/ deposition rate分类
化学化工引用本文复制引用
肖友军,许永章..以酒石酸钾钠为主络合剂的化学镀铜添加剂研究[J].表面技术,2012,41(5):102-104,107,4.
