强激光与粒子束2012，Vol.24Issue(9)：2089-2093,5.DOI:10.3788/HPLPB20122409.2089
Au80Sn20合金焊料制备工艺
Fabrication technology of Au80Sn20 alloy solder
摘要
Abstract
For the packaging demand of high power diode laser, the method of magnetron sputtering was used to fabricate the Au80Sn20 alloy solder. A scanning electron microscope (SEM) was adopted to observe its microstructure and surface topography, an energy dispersive X-ray detector(EDX) to test its composition, and the differential thermal analysis (DTA) to test its melting temperature. The weldability of the Au80Sn20 alloy solder was analyzed by reflow soldering process. In conclusion, using magnetron sputtering can successfully manufacture the Au80Sn20 alloy solder. The prepared Au80Sn20 alloy solder features compact surface structure, easy wetting, small void content, and large bonding strength. Its composition and melting point are close to the theoretical situation.关键词
Au80Sn20合金焊料/高功率二极管激光器/磁控溅射/合金靶Key words
Au80Sn20 alloy solder/ high power diode laser/ magnetron sputtering/ alloy target分类
信息技术与安全科学引用本文复制引用
王昭,吕文强,高松信,武德勇..Au80Sn20合金焊料制备工艺[J].强激光与粒子束,2012,24(9):2089-2093,5.基金项目
国家自然科学基金重大项目(60890201) （60890201）
