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A SPICE model for a phase-change memory cell based on the analytical conductivity model

Wei Yiqun Lin Xinnan Jia Yuchao Cui Xiaole He Jin Zhang Xing

半导体学报(英文版)2012,Vol.33Issue(11):52-56,5.
半导体学报(英文版)2012,Vol.33Issue(11):52-56,5.DOI:10.1088/1674-4926/33/11/114004

A SPICE model for a phase-change memory cell based on the analytical conductivity model

A SPICE model for a phase-change memory cell based on the analytical conductivity model

Wei Yiqun 1Lin Xinnan 1Jia Yuchao 1Cui Xiaole 1He Jin 2Zhang Xing3

作者信息

  • 1. The Key Laboratory of Integrated Microsystems, Shenzhen Graduate School of Peking University, Shenzhen 518055, China
  • 2. The Key Laboratory of Integrated Microsystems, Shenzhen Graduate School of Peking University, Shenzhen 518055, China
  • 3. peking University Shenzhen SOC Key Laboratory, PKU-HKUST, Shenzhen-Hong Kong Institute, Shenzhen 518055, China
  • 折叠

摘要

Abstract

By way of periphery circuit design of the phase-change memory,it is necessary to present an accurate compact model of a phase-change memory cell for the circuit simulation.Compared with the present model,the model presented in this work includes an analytical conductivity model,which is deduced by means of the carrier transport theory instead of the fitting model based on the measurement.In addition,this model includes an analytical temperature model based on the 1D heat-transfer equation and the phase-transition dynamic model based on the JMA equation to simulate the phase-change process.The above models for phase-change memory are integrated by using Verilog-A language,and results show that this model is able to simulate the Ⅰ-Ⅴ characteristics and the programming characteristics accurately.

关键词

phase-change memory/ compact model/ analytical/ conductivity

Key words

phase-change memory/ compact model/ analytical/ conductivity

引用本文复制引用

Wei Yiqun,Lin Xinnan,Jia Yuchao,Cui Xiaole,He Jin,Zhang Xing..A SPICE model for a phase-change memory cell based on the analytical conductivity model[J].半导体学报(英文版),2012,33(11):52-56,5.

基金项目

Project supported by the National Natural Science Foundation of China (Nos.61176099,61006032,60925015). (Nos.61176099,61006032,60925015)

半导体学报(英文版)

OACSCDCSTPCDEI

1674-4926

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