电焊机2012，Vol.42Issue(12)：66-69,4.
Anand本构方程在焊点可靠性研究中的应用
Application of anand constitutive equations in solder joints reliability
王旭艳 1徐仁春 2刘刚1
作者信息
- 1. 南京电子技术研究所,江苏南京210039
- 2. 南京汽车集团有限公司,江苏南京210061
- 折叠
摘要
Abstract
Service life of the electronics is decided by the reliability of solder joint .therefore,higher reliability of the solder joint is required in the field of micro-electronics.Finite Element Modeling technology is an important method to study the reliability of solder joint.Anand constitutive model which is a nonlinear equation unified with creep and plastic deformation was reviewed systematically in the text.Evolution,study status and the calculation of nine constants of this constitutive equation were introduced,and the determination of parameters and modification of the constitutive equation at home and abroad were analysed.In aspect of study of solder joint reliability .applying of the constitutive model to stress-strain analysis and fatigue life of QFP and BCA solder joint was discussed,which can provide the theory guide for practical applications.Meanwhile,new requirement for building and amending the constitutive model was proposed to study the reliability of solder joint better.关键词
Anand本构模型/蠕变/微电子焊接/焊点可靠性Key words
Anand constitutive model/ creep/ microelectronic joining/ solder joint reliability分类
矿业与冶金引用本文复制引用
王旭艳,徐仁春,刘刚..Anand本构方程在焊点可靠性研究中的应用[J].电焊机,2012,42(12):66-69,4.
