发光学报2012，Vol.33Issue(12)：1362-1367,6.DOI:10.3788/fgxb20123312.1362
去除铝基板的大功率LED热分析
Thermal Analysis of High-power LED Without Aluminum Substrate
摘要
Abstract
A novel method that without aluminum substrate high-power LED encapsulation is proposed. The thermal properties of traditional structure and this new structure is simulated by using finite element analysis software. The simulation results show that the maximum temperatures appear in the LED chips. Comparing with the traditional structure, the maximum temperatures of the new structure respectively lower 6.436, 9. 468 and 19. 309? when the input power is lxl W,3xl W and 1x3 W. Even if the thermal conductivity of substrate reaches as high as 200 W/(m ?K), the heat dissipation effect is still better than the structure with aluminum substrate. The heat dissipation effect of the new structure is obviously superior to that of aluminum substrate structure. With the increase of input power, the advantage of the new structure is more remarkable. It provides a new way to solve the heat dissipation problem of high power LED.关键词
热阻/大功率LED/铝基板/ANSYS有限元分析/热分析Key words
thermal resistance/ high-power LED/ aluminum substrate/ ANSYS finite element analysis/ thermal analysis分类
信息技术与安全科学引用本文复制引用
陈建龙,文尚胜,姚日晖,汪峰..去除铝基板的大功率LED热分析[J].发光学报,2012,33(12):1362-1367,6.基金项目
广东省科技厅重大科技专项(2011A080801016) （2011A080801016）
广东省战略性新兴产业专项(2011A081301017)资助项目 （2011A081301017）
