金刚石与磨料磨具工程2012，Vol.32Issue(5)：42-45,51,5.
大尺寸硅片智能化CMP监控系统研究
Study on intelligent CMP monitoring system of large-size silicon wafer
摘要
Abstract
The design ideas of intelligent control and the influencing mechanism of the process parameters on chemical mechanical polishing (CMP) are combined to develop the intelligent CMP monitoring system, which has the function of learning, inference and memory. The system can be used in many kinds of CMP facilities, the process parameter from the system can be used to control each unit of the CMP facility. Compared with the conventional way of processing by virtue of experience, the system has friendly operator interface and is easy to operate. The volume production of silicon wafers can be achieved by the total intelligent monitoring of CMP. The efficiency of production can be improved highly and the quality can be ensured.关键词
智能监控/硅片/化学机械抛光(CMP)/生产效率Key words
intelligent monitoring/ silicon wafer/ chemical mechanical polishing ( CMP) / efficiency of production分类
矿业与冶金引用本文复制引用
郭晓光,张小冀,郭东明..大尺寸硅片智能化CMP监控系统研究[J].金刚石与磨料磨具工程,2012,32(5):42-45,51,5.基金项目
中央高校基本科研业务费专项资金资助(DUT11SX05) （DUT11SX05）
