金刚石与磨料磨具工程2012，Vol.32Issue(5)：46-51,6.
硅晶体线切割液的研究进展与发展趋势
Progress and development trends of cutting fluid for multi-wire sawing process
摘要
Abstract
With the advantages of cutting large diameter and very thin wafers, multi-wire saw is widely used as a leading method for silicon crystal slicing. The cutting fluid plays an important role in the machining process. First, the mechanism of cutting fluid was discussed. Second, the composition of the cutting fluid and the impact of process parameters on cutting fluid were reviewed. Finally, the main problems and the future development direction of cutting fluid were pointed out.关键词
多线切割/线切割液/工艺参数/组成配方Key words
multi-wire sawing/ wire cutting fluid/ process parameter/ composition formula分类
化学化工引用本文复制引用
熊次远,李庆忠,钱善华,闫俊霞..硅晶体线切割液的研究进展与发展趋势[J].金刚石与磨料磨具工程,2012,32(5):46-51,6.基金项目
国家自然科学基金项目(51175228) （51175228）
2011年度江苏省研究生创新工程项目. （）
