电焊机2013,Vol.43Issue(2):121-123,3.DOI:10.7512/j.issn.1001-2303.2013.02.24
一种可靠的功率器件绝缘与热传导路径设计
A reliable design on insulation and thermal conduction path of power device
杨年法 1刘钢 1盛占石 1陈亮 1徐涛1
作者信息
摘要
Abstract
By testing the Case and the heat sink temperature of the same IGBT under the same conditions in the shells of different sizes of copper,thermal resistance of each conductive path is calculated to analyse the relationship between thermal resistance and the contact surface size. The size of the copper block power devices required for the safe temperature range is calculated according to this relationship,the feasibility of this conclusion is verified by FLOTHERM.a professional thermal simulation software. Finally,the temperature of power devices is measured, which is basically in line with the simulation. 关键词
功率器件/绝缘/热传导/热阻Key words
power device/ insulation/ thermal conductivity/ resistance分类
矿业与冶金引用本文复制引用
杨年法,刘钢,盛占石,陈亮,徐涛..一种可靠的功率器件绝缘与热传导路径设计[J].电焊机,2013,43(2):121-123,3.