金刚石与磨料磨具工程2013，Vol.33Issue(1)：6-9,4.
铜/金刚石复合材料热导率正交实验研究
Thermal conductivity of Cu/diamond composites by orthogonal experiment method
摘要
Abstract
Cu/diamond composites were prepared by high temperature and high pressure (HTHP) method. Factors including diamond grit size, the volume ratio of two sizes of diamond, the volume ratio of Cu and diamond, and the time of pressure maintaining and heat preservation were investigated to illustrate their influences on the thermal conductivity of composites based on orthogonal experiments. The results showed that the volume ratio of Cu and diamond was the most pivotal factor, while the volume ratio of two sizes of diamond was the least impact on the thermal conductivity. In order to improve the thermal conductivity of Cu/diamond composites, the optimized preparation process parameters were studied and obtained as follows; the volume ratio of large size (250 (μm) diamond to the small size (75μm) diamond was 1:4, the volume ratio of Cu and diamond was 7-3, the time of pressure maintaining was 2 h. Under the optimized parameters, Cu/diamond composites with thermal conductivity of 238. 18 W/(m · K) were obtained.关键词
铜/金刚石复合材料/高温高压法/正交实验法/热导率Key words
Cu/diamond composites/high temperature and high pressure method/ orthogonal experiment/thermal conductivity分类
通用工业技术引用本文复制引用
丁彬彬,范广涵,周德涛,赵芳,郑树文,熊建勇,宋晶晶,喻晓鹏,张涛..铜/金刚石复合材料热导率正交实验研究[J].金刚石与磨料磨具工程,2013,33(1):6-9,4.基金项目
国家自然科学基金(61176043) （61176043）
广东省战略性新兴产业专项资金(2010A081002005,2011A081301003,2012A080304016). （2010A081002005,2011A081301003,2012A080304016）
