金刚石与磨料磨具工程2013，Vol.33Issue(1)：65-69,5.
电镀金刚石线锯超声振动切割多晶硅材料工艺研究
Ultrasonic vibration cutting of polysilicon with diamond wire saw
摘要
Abstract
Polysilicon slices were cut with electroplated diamond wire saw under ultrasonic vibration. Influences of several process parameters on the material removal rate, including diamond grit size, ultrasonic pressure and line speed, were studied. The contact model of the single diamond grain was established. Results showed that a high removal rate could be obtained by increasing diamond grit size, static pressure or line speed. With ultrasonic vibration, the cutting efficiency could be increased by an average of 1 to 2.5 times.关键词
多晶硅片/超声波加工/金刚石线锯/材料去除率Key words
polysilicon slices/ultrasonic machining/diamond wire saw/material removal rate分类
化学化工引用本文复制引用
张辽远,韩东泽..电镀金刚石线锯超声振动切割多晶硅材料工艺研究[J].金刚石与磨料磨具工程,2013,33(1):65-69,5.基金项目
辽宁省科技创新团队项目资助 （）
