表面技术2013，Vol.42Issue(2)：74-76,3.
化学镀镍施镀过程稳定性分析
Evaluation on Plating Stability in Electroless Nickel Deposition
摘要
Abstract
Based on the action mechanism of electroless nickel deposition, the factors affecting the stability of the plating solution, such as salinity ( nickelous sulfate and sodium hypophosphite) , pH value, temperature and operating methods were analyzed. It is indicated that when the concentration of Nickel and hypophosphite acid is 5. 8 g/L and 17.4 g/L respectively, and pH value is 4. 4, the best plating stability can be achieved under 82 ℃.关键词
化学镀镍/镀液稳定性/沉积速率Key words
electroless Ni plating/ bath stability/ deposition rate分类
化学化工引用本文复制引用
陈月华,刘永永,江德凤,袁礼华..化学镀镍施镀过程稳定性分析[J].表面技术,2013,42(2):74-76,3.
