金刚石与磨料磨具工程2013，Vol.33Issue(2)：14-18,5.
金刚石超薄切割砂轮减薄研磨工艺的研究
Thinning process of diamond ultrathin cutting wheel
摘要
Abstract
The free diamond abrasive was used for thinning the diamond ultrathin cutting wheel which was sintered by vacuum hot pressing. The influences of lapping parameters on the results were discussed, such as the feeding way of free abrasive, the fixed mode of cutting wheel, the time of single side lapping, the speed of cast iron plate, the size of abrasive grains and the pressure of lapping thinning. Results showed that the thickness of diamond cutting wheel decreased from 0.5 mm to 0. 38 mm, and that the thickness uniformity was improved and the relative warp degree of diamond ultrathin cutting wheel was reduced.关键词
金刚石超薄切割砂轮/减薄/游离磨料Key words
diamond ultrathin cutting wheel/ thinning/ free abrasive分类
化学化工引用本文复制引用
刘海锋,何亮,郭桦..金刚石超薄切割砂轮减薄研磨工艺的研究[J].金刚石与磨料磨具工程,2013,33(2):14-18,5.基金项目
国家自然科学基金(51175193) （51175193）
长江学者与创新团队发展计划(IRT1063) （IRT1063）
福建省科技计划项目(201010009). （201010009）
