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Self-adaptive phosphor coating technology for wafer-level scale chip packaging

Zhou Linsong Rao Haibo Wang Wei Wan Xianlong Liao Junyuan Wang Xuemei Zhou Da

半导体学报（英文版）2013，Vol.34Issue(5)：96-99,4.

半导体学报（英文版）2013，Vol.34Issue(5)：96-99,4.DOI:10.1088/1674-4926/34/5/054010

Self-adaptive phosphor coating technology for wafer-level scale chip packaging

Zhou Linsong ¹Rao Haibo ¹Wang Wei ¹Wan Xianlong ¹Liao Junyuan ¹Wang Xuemei ¹Zhou Da¹

作者信息

1. School of Opto-Electronic Information, University of Electronic Science and Technology of China, Chengdu 610054, China
折叠

摘要

关键词

white light-emitting diodes/ self-adaptive conformal coating/ wafer level encapsulation technology/multi-chip packaging

Key words

white light-emitting diodes/ self-adaptive conformal coating/ wafer level encapsulation technology/multi-chip packaging

引用本文复制引用

Zhou Linsong,Rao Haibo,Wang Wei,Wan Xianlong,Liao Junyuan,Wang Xuemei,Zhou Da..Self-adaptive phosphor coating technology for wafer-level scale chip packaging[J].半导体学报（英文版）,2013,34(5):96-99,4.

基金项目

Project supported by the Guangdong Province Scientific Research Program (Nos.2011B090400083,2011A081301019). （Nos.2011B090400083,2011A081301019）

半导体学报（英文版）

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ISSN：1674-4926

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