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The effects of cure temperature history on the stability of polyimide films

Ning Wenguo Li Heng Zhu Chunsheng Luo Le Chen Dong Duan Zhenzhen

半导体学报（英文版）2013，Vol.34Issue(6)：27-31,5.

半导体学报（英文版）2013，Vol.34Issue(6)：27-31,5.DOI:10.1088/1674-4926/34/6/063003

The effects of cure temperature history on the stability of polyimide films

Ning Wenguo ¹Li Heng ²Zhu Chunsheng ¹Luo Le ²Chen Dong ¹Duan Zhenzhen²

作者信息

1. The State Key Laboratories of Transducer Technology, Shanghai Institute of Microsystem and Information Technology,Chinese Academy of Sciences, Shanghai 200050, China
2. University of Chinese Academy of Sciences, Beijing 100049, China
折叠

摘要

关键词

curing of polymers/polyimide/stabilization/DMA

Key words

curing of polymers/polyimide/stabilization/DMA

引用本文复制引用

Ning Wenguo,Li Heng,Zhu Chunsheng,Luo Le,Chen Dong,Duan Zhenzhen..The effects of cure temperature history on the stability of polyimide films[J].半导体学报（英文版）,2013,34(6):27-31,5.

基金项目

Project supported by the National Science and Technology Major Project (No.2009ZX02025-1). （No.2009ZX02025-1）

半导体学报（英文版）

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ISSN：1674-4926

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