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Two-dimensional simulation of inductively coupled plasma based on COMSOL and comparison with experimental data

Cheng Jia Ji Linhong Wang Kesheng Han Chuankun Shi Yixiang

半导体学报（英文版）2013，Vol.34Issue(6)：174-180,7.

半导体学报（英文版）2013，Vol.34Issue(6)：174-180,7.DOI:10.1088/1674-4926/34/6/066004

Two-dimensional simulation of inductively coupled plasma based on COMSOL and comparison with experimental data

Cheng Jia ¹Ji Linhong ²Wang Kesheng ¹Han Chuankun ²Shi Yixiang¹

作者信息

1. Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China
2. State Key Laboratory of Tribology, Tsinghua University, Beijing 100084, China
折叠

摘要

关键词

inductively coupled plasma/simulation/COMSOL

Key words

inductively coupled plasma/simulation/COMSOL

引用本文复制引用

Cheng Jia,Ji Linhong,Wang Kesheng,Han Chuankun,Shi Yixiang..Two-dimensional simulation of inductively coupled plasma based on COMSOL and comparison with experimental data[J].半导体学报（英文版）,2013,34(6):174-180,7.

基金项目

Project supported by the National Science & Technology Major Project No.02 (No.2011ZX02403-004) and the Research Project from State Key Laboratory of Tribology in Tsinghua University (No.SKLT11C2). （No.2011ZX02403-004）

半导体学报（英文版）

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ISSN：1674-4926

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