表面技术2013，Vol.42Issue(3)：1-4,37,5.
铜在磷酸溶液中的电化学抛光研究
Research on the Copper Electrochemical Polishing in Phosphoric Acid
摘要
Abstract
The eletrochemical properties of Cu eletrochemical polishing in phophoric acid solutions has been studied by anodic polarization and electrochemical impedance spectroscopy (EIS) technique.The roughness of Cu firstly decreased,and then increased with the concentration of H3 PO4 increased at 0.2 V,0.4 V,0.6 V and 0.8 V,and reached the minimum roughness value when the H3PO4 concentration was 55％.The Rs value at different potential,fitting results of EIS,suggested the change in the resistance of viscous phosphate and Cu oxide films.With the increase of phosphate concentration,the relaxation time of the first capacitive semicircle extended,and it mean the acceleration in the copper dissolution reaction.关键词
铜/磷酸/电化学抛光/粗糙度/电化学阻抗谱Key words
copper/ phosphoric acid/electrochemical polishing/ roughness/electrochemical impedance spectroscopy分类
矿业与冶金引用本文复制引用
黎德育,夏国锋,郑振,王紫玉,田栋,王晨,翟文杰,李宁..铜在磷酸溶液中的电化学抛光研究[J].表面技术,2013,42(3):1-4,37,5.基金项目
国家自然科学基金资助项目(50975058) （50975058）
