硅酸盐通报2013，Vol.32Issue(6)：999-1004,6.
硅晶片抛光用高纯度大粒径硅溶胶的研究
Study on the Silica Sol with High Purity and Large Particle Size that Suitable for Silicon Wafer Polishing
摘要
Abstract
Taking the silicon powder hydrolysis-colloidal particle arrangement for preparation the silica sol of silicon wafer polishing,Several effects of reaction factors were investigated and optimum conditions were confirmed as follows:the best addition amount of simple substance silicon powder was 25 g,the best reaction time was 7 h,the best reaction temperature was 80 ℃,the mass concentration of the silica sol bottom fluid was 8％,choose dilute aqueous ammonia as catalyst and the dosage was 12 mL.Under the optimum conditions,can get the silica sol products with the average grain size of 20 nm.After many particle growth can get the high purity and large particle size silicon sol that suitable for silicon wafer polishing industry.关键词
硅晶片抛光/高纯度/大粒径/硅溶胶Key words
silicon wafer polishing/ high purity/ large particle size / silicon sol分类
化学化工引用本文复制引用
郑典模,潘鹤政,屈海宁,陈骏驰,彭静红..硅晶片抛光用高纯度大粒径硅溶胶的研究[J].硅酸盐通报,2013,32(6):999-1004,6.基金项目
南昌大学研究生创新基金(cx2012013) （cx2012013）
