首页|期刊导航|半导体学报（英文版）|New de-embedding structures for extracting the electrical parameters of a through-silicon-via pair
半导体学报（英文版）2013，Vol.34Issue(4)：80-86,7.DOI:10.1088/1674-4926/34/4/045004
New de-embedding structures for extracting the electrical parameters of a through-silicon-via pair
New de-embedding structures for extracting the electrical parameters of a through-silicon-via pair
摘要
关键词
through-silicon vias/ de-embedding structure/ microwave network/ multiple solutions/ transmission matrix/ equivalent circuitKey words
through-silicon vias/ de-embedding structure/ microwave network/ multiple solutions/ transmission matrix/ equivalent circuit引用本文复制引用
Zhou Jing,Wan Lixi,Li Jun,Wang Huijuan,Dai Fengwei,Daniel Guidotti,Cao Liqiang..New de-embedding structures for extracting the electrical parameters of a through-silicon-via pair[J].半导体学报（英文版）,2013,34(4):80-86,7.基金项目
Project supported by the Opening Project of Key Laboratory of Microelectronics Devices & Integrated Technology,Institute of Microelectronics,Chinese Academy of Sciences.Yu Daquan also appreciates the support by 100 Talents Program (No.Y0YB049001) of Chinese Academy of Sciences. （No.Y0YB049001）
