电焊机2013，Vol.43Issue(7)：88-91,4.DOI:10.7512/j.issn.1001-2303.2013.07.21
国内无铅焊点可靠性有限元模拟研究最新进展
Research status on reliability of lead-free solder joints in domestic
摘要
Abstract
This paper introduced the status of lead-free solders reliability based on finite element simulation.With the miniaturation and high-reliability transformation of electronic devices,the sizes of lead-free solder joints become smaller,and its reliability investigation turns into the important research subject.Comparing with abroad achievements in this field,it is found that the productions of Chinese researcher have obvious advance,however,the theories findings are weak,and it is need great efforts to improve it.关键词
SCI/EI/无铅焊点/可靠性/有限元模拟Key words
SCI/EI/ lead-free solder joints / reliability/ finite element simulation分类
矿业与冶金引用本文复制引用
郦金花,张亮..国内无铅焊点可靠性有限元模拟研究最新进展[J].电焊机,2013,43(7):88-91,4.基金项目
江苏省自然科学基金资助项目(BK201244) （BK201244）
江苏省高校自然科学基金(12KJB460005) （12KJB460005）
江苏科技大学先进焊接技术省级重点实验开放研究基金(JSAWS-11-03) （JSAWS-11-03）
江苏师范大学自然科学基金资助项目(11XLR16) （11XLR16）
