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The abnormal electrostatic discharge of a no-connect metal cover in a ceramic packaging device

Li Song Zeng Chuanbin Luo Jiajun Han Zhengsheng

半导体学报（英文版）2013，Vol.34Issue(8)：74-78,5.

半导体学报（英文版）2013，Vol.34Issue(8)：74-78,5.DOI:10.1088/1674-4926/34/8/084007

The abnormal electrostatic discharge of a no-connect metal cover in a ceramic packaging device

Li Song ¹Zeng Chuanbin ¹Luo Jiajun ¹Han Zhengsheng¹

作者信息

1. Institute of Microeletronics, Chinese Academy of Sciences, Beijing 100029, China
折叠

摘要

关键词

electrostatic discharge/ human body model/ no-connect metal cover/ sparkover

Key words

electrostatic discharge/ human body model/ no-connect metal cover/ sparkover

引用本文复制引用

Li Song,Zeng Chuanbin,Luo Jiajun,Han Zhengsheng..The abnormal electrostatic discharge of a no-connect metal cover in a ceramic packaging device[J].半导体学报（英文版）,2013,34(8):74-78,5.

基金项目

Project supported by the National Natural Science Foundation of China (No.60927006). （No.60927006）

半导体学报（英文版）

OACSCDCSTPCDEI

ISSN：1674-4926

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