航天器环境工程2013，Vol.30Issue(3)：292-295,4.DOI:10.3969/j.issn.1673-1379.2013.03.013
航天器单机内PCB焊点低气压放电试验研究
Low-pressure discharging test for solder fillets on PCBs used in spacecraft units
摘要
Abstract
The risk of discharging always exists inside the unit of spacecraft.Therefore,for PCBs working in a relatively high voltage,anti-discharge techniques and measures are necessary.To evaluate some present anti-discharge technologies,the corona inception voltage(CIV) of solder fillets under different technological conditions is measured.The results show that in similar conditions,the CIV of round shape solder fillets is higher than that of the ordinary solder fillets; there is no obvious difference for solder fillets with or without gap between them; the CIV of solder fillets with functional paint is considerably higher than those without paint.The above test results may provide some guidance for anti-discharge measures for PCBs used in spacecraft.关键词
印刷电路板/焊电极/低气压放电/起晕电压/放电防护Key words
printed circuit board(PCB)/ solder fillet/ low-pressure discharge/ corona inception voltage/ protection of discharging分类
航空航天引用本文复制引用
王志浩,冯伟泉,周岭,徐焱林,刘业楠,聂翔宇,张永泰,侯清锋..航天器单机内PCB焊点低气压放电试验研究[J].航天器环境工程,2013,30(3):292-295,4.基金项目
中国航天科技集团公司共性工艺课题 （）
