云南冶金2013，Vol.42Issue(4)：46-49,63,5.
Cu-W、Cu-Mo薄膜的微观结构及显微硬度分析
Analysis on Microstructure and Microhardness of Cu-W, Cu-Mo Thin Film
摘要
Abstract
The two kinds of copper thin films with W or Mo are prepared by magnetron co-sputtering method,the composition,structure,morphology and microhardness of thin films is analyzed by EDX,XRD,SEM and nanometer indentation testers.The results show that the prepared Cu-W and Cu-Mo thin film all present crystalline state structure,Cu-W and Cu-Mo forms uniform solid solution; the grains in Cu-W and Cu-Mo thin film grow up after the heat treatment for one hour at 650℃,there is enriched W and Mo phase precipitated dispersively from the host Cu phase ; the microhardness of Cu-W thin film is increased and then decreased along with the increasing of W ;the microhardness of Cu-Mo thin film constantly rise along with the increasing of Mo,the microhardness of annealed thin film is lower than as-deposited thin film.The analysis show that the reasons for the above results are caused by addition of W,Mo,which leads to grain refinement effect and poor thermal stability of the thin film.关键词
Cu-W薄膜/Cu-Mo薄膜/微观结构/硬度Key words
Cu-W thin film/ Cu-Mo thin film/ microstructure/ hardness分类
矿业与冶金引用本文复制引用
王丽,郭诗玫,周应强,朱志军,周铖,刘国涛..Cu-W、Cu-Mo薄膜的微观结构及显微硬度分析[J].云南冶金,2013,42(4):46-49,63,5.基金项目
曲靖师范学院实验教学研究项目(syjx2011003). （syjx2011003）
