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Circuit modeling and performance analysis of SWCNT bundle 3D interconnects

Qian Libo Zhu Zhangming Ding Ruixue Yang Yintang

半导体学报（英文版）2013，Vol.34Issue(9)：171-177,7.

半导体学报（英文版）2013，Vol.34Issue(9)：171-177,7.DOI:10.1088/1674-4926/34/9/095014

Circuit modeling and performance analysis of SWCNT bundle 3D interconnects

Qian Libo ¹Zhu Zhangming ¹Ding Ruixue ¹Yang Yintang¹

作者信息

1. Key Laboratory of Wide Band-Gap Semiconductor Materials and Devices, School of Microelectronics, Xidian University, Xi'an 710071, China
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摘要

关键词

three-dimensional integrated circuits (3D ICs)/ carbon nanotube (CNT)/ signal delay/ repeater insertion

Key words

three-dimensional integrated circuits (3D ICs)/ carbon nanotube (CNT)/ signal delay/ repeater insertion

引用本文复制引用

Qian Libo,Zhu Zhangming,Ding Ruixue,Yang Yintang..Circuit modeling and performance analysis of SWCNT bundle 3D interconnects[J].半导体学报（英文版）,2013,34(9):171-177,7.

基金项目

Project supported by the National Natural Science Foundation of China (Nos.61234002,61006028,61204044) and the National High-Tech Program of China (Nos.2012AA012302,2013AA011203). （Nos.61234002,61006028,61204044）

半导体学报（英文版）

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ISSN：1674-4926

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