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Low temperature Sn-rich Au-Sn wafer-level bonding

Fang Zhiqiang Mao Xu Yang Jinling Yang Fuhua

半导体学报（英文版）2013，Vol.34Issue(10)：161-164,4.

半导体学报（英文版）2013，Vol.34Issue(10)：161-164,4.DOI:10.1088/1674-4926/34/10/106001

Low temperature Sn-rich Au-Sn wafer-level bonding

Fang Zhiqiang ¹Mao Xu ²Yang Jinling ¹Yang Fuhua²

作者信息

1. Research Center of Engineering for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
2. State Key Laboratory of Transducer Technology, Shanghai 200050, China
折叠

摘要

关键词

MEMS packaging/ Au-Sn solder/ Sn-rich/ bonding strength

Key words

MEMS packaging/ Au-Sn solder/ Sn-rich/ bonding strength

引用本文复制引用

Fang Zhiqiang,Mao Xu,Yang Jinling,Yang Fuhua..Low temperature Sn-rich Au-Sn wafer-level bonding[J].半导体学报（英文版）,2013,34(10):161-164,4.

基金项目

Project supported by the State Key Development Program for Basic Research of China (Nos.2009CB320305,2011CB933102) and the National Natural Science Foundation of China (Nos.61234007,61201104,61274001). （Nos.2009CB320305,2011CB933102）

半导体学报（英文版）

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ISSN：1674-4926

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