首页|期刊导航|半导体学报（英文版）|Electrochemical investigation of copper chemical mechanical planarization in alkaline slurry without an inhibitor

Electrochemical investigation of copper chemical mechanical planarization in alkaline slurry without an inhibitor

Wang Aochen Wang Shengli Liu Yuling Li Yan

半导体学报（英文版）2014，Vol.35Issue(2)：141-146,6.

半导体学报（英文版）2014，Vol.35Issue(2)：141-146,6.DOI:10.1088/1674-4926/35/2/026003

Electrochemical investigation of copper chemical mechanical planarization in alkaline slurry without an inhibitor

Wang Aochen ¹Wang Shengli ¹Liu Yuling ¹Li Yan¹

作者信息

1. Institute of Microelectronics, Hebei University of Technology, Tianjin 300130, China
折叠

摘要

关键词

alkaline slurry/ electrochemical/ copper/ CMP/ surface roughness

Key words

alkaline slurry/ electrochemical/ copper/ CMP/ surface roughness

引用本文复制引用

Wang Aochen,Wang Shengli,Liu Yuling,Li Yan..Electrochemical investigation of copper chemical mechanical planarization in alkaline slurry without an inhibitor[J].半导体学报（英文版）,2014,35(2):141-146,6.

基金项目

Project supported by the Natural Science Foundation of Hebei Province,China (No.E2013202247) and the Fund Project of Hebei Province Department of Education,China (No.2011128). （No.E2013202247）

半导体学报（英文版）

OACSCDCSTPCDEI

ISSN：1674-4926

访问量0

下载量0

段落导航